Learn about cryptographic hardware device protection using laser direct structuring (LDS) to create hardware protection circuitry on low cost injection molded housings and enclosures.
Laser Direct Structuring (LDS) is the most widely used method to produce cell phone handset antenna. It is now being used to integrate Wi-Fi, Bluetooth, GPS and cellular antenna into housings and enclosures. Cost reductions, rapid development of new designs and reduced space requirements are driving LDS created antennas. www.selectconnecttech.com
Presenter's Notes: 1 Thank you for attending this mornings webcast, 3-D molded interconnect device technical review.
Contents
3D MID Double-Shot and Laser Direct Structuring Processes LDS Materials LDS Design Rules Applications/Markets Contents
Presenter's Notes: This is a technical review for electrical and mechanical engineers and project managers involved in designing your next-generation products. We will cover the two processes for producing 3-dimensional molded interconnects; Double-Shot molding and Laser Direct Structuring, with an emphasis on laser direct structuring.We will briefly examine available LDS materials and the fundamental design rules for designing LDS 3D MID. And conclude with application examples employing 3-D MID, from the medical device, automotive, sensors, antenna and RFID fields. 2
3D-Interconnects by DS / LDS
3D-Interconnects by DS / LDS Double-Shot Single-Shot LDS
Presenter's Notes: 3 Three dimensional molded interconnect devices are a method to integrate electronic circuitry and electrical components with injection molded carriers and enclosures and are used to miniaturize assemblies, reduce the bill of material, simplify designs, reduce assembly time and reduce costs of components and assemblies. The double-shot process is illustrated with the disposable insulin pump on the left, where circuitry is constructed by over-molding a plateable polycarbonate/ABS resin grade formed in the shape of the desired circuit, with a non-plateable polycarbonate material forming the chassis. The component is chemically etched and only the PC/ABS blended material is activated by the etchant. The plateable material is activated for plating using a palladium salt solution and the component is plated using an electroless process to complete the formation of the circuitry.The laser direct structuring method is illustrated in the part on the right. A laser is used to scribe circuit patterns onto a three-dimensional single-shot injection molded component. Both processes use an electroless plating process called the SelectConnect Process to metalize the circuit patterns, laying down a layer of electroless copper, electroless nickel, and finally, a layer of immersion gold or electrolytic gold for applications that require thicker layer of gold. It will focus on the LDS method of producing three-dimensional interconnects in this review.
LDS 3-D MID
LDS 3-D MID
Presenter's Notes: 4 LDS 3D-MID are comprised of injection molded thermoplastic components overlaid with circuit traces drawn on the three-dimensional part using a laser marking system. The plastic components are made from material doped with organometallic micro-particles. The areas marked by the laser are activated and are plateable using electroless plating chemistry. The circuit traces are drawn on the three-dimensional CAD model as a zero-height surface. A .step file is exported from the CAD system for translation into laser coordinates. The pattern is aligned using optically detected fiducials located on the component or the laser table and the pattern is scanned onto the part using preprogrammed laser parameters appropriate for the type of material.
LDS Summary
LDS Summary
Presenter's Notes: 5 The LDS process for producing 3-D MID is about 10 years old. It was developed in Germany by LPKF Laser and Electronics and for the first five or six years was a application looking for problem to solve. The first high volume application employing the LDS method for producing 3-D MID was in the area of cell phone antennas. Historically, antennas were modeled by hand, placing metal foil over forms and the antenna patterns were cut by hand using an Exact-O knife. The test piece was then placed in the RF range for evaluation. A new iteration of the antenna would require repeating this laborious process. Using the LDS process allows changes to be made to the drawing and accurately translated to parts in less time and with a higher degrees of accuracy.
LDS Summary
LDS Summary
Presenter's Notes: 6 Today: LDS is a mature, robust technology Cell Phone Antenna production is largest application, with tens of millions produced annually Europe is currently experiencing rapid growth in automotive, with BMW taking the lead, medical devices, antennas systems, sensors and RF-ID tags
LDS Technical Summary
LDS Technical Summary Laser Direct Structuring LDS
Presenter's Notes: 7 The laser source is a 16W diode pumped Neodymium-doped yttrium orthovanadate (Nd:YVO4) system operating in the near-infrared at 1064 nm with a focused spot size of 65µm. The system uses a high-speed scanner and optical z-axis for the 3D beam delivery with typical positioning speeds in the range of 1 to 4 meters per second.The lasers interaction with the material surface is two-fold, the beam activates the surface by reducing the organometallic dopant to metal particles and it roughens up the surface providing a texture for mechanical adherence of the metalized layer.
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: 8 We often denote the lasers impact on the material surface as a channel carved out of the material, but recent data for PC/ABS material shows just the opposite. The surface hit by the laser is roughened and raised in columnar fashion some 5 to 25 µm.
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: 9 Here is a profile of a circuit after plating.
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: In a view from an variable pressure Scanning Electron Microscope (SEM), the surface topography is evident. 10
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: In this SEM image a Back-Scattered Electron Detector highlights the metal catalyst additive appearing here as bright spots. 11
LDS Pitch for High Yield
LDS Pitch for High Yield 8 mil lines 10 mil spaces (18 mil pitch)
Presenter's Notes: 12 LDS resolution of 6 mil lines and 8 mil spaces possible, with higher yields from 8 mil lines and 10 mil spaces. 4 mil lines and 6 mil spaces is possible on LCP material.
Business Drivers for 3D-MID
Kavo Dental Tool Business Drivers for 3D-MID
Presenter's Notes: 13 Why pursue an LDS 3D-MID strategy? The LDSs market drivers are to Reduce: Reduce Size, weight and complexity of assemblies And to reduce Costs through reduction in number of components, wires, interconnects and assembly time Benefits include improvement in: Reliability Functionality Here we see an example of a newly designed dental cavity detection system that uses LDS components. The new design features a completely self contained hand held laser caries detection system.
Business Drivers for 3D-MID
Business Drivers for 3D-MID Kavo Dental Tool
Presenter's Notes: 14 The product has gone from a lunch pail sized electronics package with a tethered laser, to a self contained laser in a hand held device that communicates results wirelessly to a base station.
LDS Grade Materials
LDS Grade Materials Reflow temperatures Pb Free 245 -260° C Sn/Pb 225 -235° C
Presenter's Notes: 15 A wide range of materials is available and qualified for LDS applications, from commodity materials through engineering resins with both amorphous and semi-crystalline characteristics. A family of high heat nylons, PET, PBT and blends are amenable to lead solder reflow mounting of components and LCP resins will perform with lead-free reflow solders.====================================================== PET Polyethylene TerephthalatePBT - Polybutylene TerephthalatePPA PolyphthalamidePSU PolysulfonePES PolyethersulfoneHTN PolyamidePA6/6T- Nylons
LDS Design Rules
LDS Design Rules Siemans Hearing Aid Component
Presenter's Notes: 16 One of the important developments of 3-dimensional circuitry is the efficient use of space with the finest possible structures. When designing components for LDS production, one needs to keep a few basic design rules in mind.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 17 The areas to be laser activated must remain in the line of sight of the laser beam. The work zone of the laser is an area 160 x 160mm or approximately 6 square inches and the laser has a working distance of approximately 1 inch, which means the laser can focus on a part that has a Z range of height of 1 inch.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 18 It is possible to lase patterns on all sides of a part by designing a multi-position fixture or a fixture that can rotate parts for multiple passes.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 19 When positioning the parts in a fixture we have a maximum angle of incidence of the beam impinging on the part of 70 degrees.Angles of incidence exceeding 70° are reduced by rotating the component during laser processing.
LDS Design Rules
LDS Design Rules Optimum cycle times
Presenter's Notes: 20 For parts with multiple surfaces with 90 degree angles, the part is mounted at an angle and is rotated to complete the activation.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 21 Plated through holes are activated using Conical Vias on one or both sides depending on part thickness.Thick walls require an aspect ratio of 2:1, while thinner parts can use simple cones with a 1:1 ratio.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 22 When designing molds, we must pay attention to the location of walls and ejection pins. Zones to be activated should not directly touch walls Activation area separation for walls with an angle up to 45° should be kept at >150 µm or 6 mil Steeper walls with angles up to about 70° should be separated by 250 µm or greater or 10 mil Ejector pins should be placed to avoid the activation areas
Presenter's Notes: The plating process consists of electroless plating chemistries, typically starting with a layer of 100 to 250 micro-inches of copper, followed by a 50 to 150 micro inch layer of nickel and an optional thin layer of immersion gold or a gold layer built using electroless gold chemistry that can build a more substantial gold layer. Metal thickness can be customized to meet the needs of the design. 23
Key Markets / Applications
Key Markets / Applications
Presenter's Notes: 24 Lets take a look at some application examples in the area of: Medical Devices Military / Defense / Aerospace Automotive Electronics Antennas RFID
Medical Devices
Medical Devices OmniPod® Insulin Management System OEM: InsuletMolder:Phillips PlasticsPlater:Arlington PlatingMaterial:PC, PC/ABS (doped)Process:DS (Double Shot)
Presenter's Notes: This is the Omni Pod from Insulet Corporation. It is a disposable insulin pump and blood glucose measurement system AdvantagesDisposableCommunicates Wirelessly with the Handheld Provides mechanical support and electrical connectivity Smaller, lighter - Allows for integration of more electronic functions- Eliminates complicated assemblies 25
Medical Devices
3-dimensional PCB for Hearing AidsStereo hearing aid component: Source: Harting / Siemens process steps Material: Vectra E820i LDS Medical Devices
Presenter's Notes: 26 In this example, Siemens developed an integrated approach to mounting components on a 3-dimensional carrier for their hearing aids.
Medical Devices
Switch Ring for Caries Diagnostic Laser PenFeatures:Reduction of assembly time (6s vs. 20s)Increase of assembly yieldReduction of parts (3 vs. 8)Reduction of cost (78%) Source: KaVo Dental Material: Vectra E840i LDS Medical Devices
Presenter's Notes: 27 The Kavo dental caries detection tool Features:An LDS produced mode switch assembly that provided a:Reduction of assembly time from 20 seconds to 6 secondsIncrease of assembly yieldReduction of the number of parts from 8 to 3And a cost reduction of 78%
Presenter's Notes: Security ShieldsAre a injection molded enclosure with a layer of delicate and geometrically fine tracks covering the inside of the security housing. The tracks are less than 10 m thick making it difficult to detect using X-rays. They are designed to protect against conducting and non-conducting drill bits and are resistant to chemical attack.Benefits over other solutions include: It is simple to attach to the PCB Fewer assembly steps The elimination of epoxy potting The design allows for recovery of PCB for repair, upgrade or data recovery Housing can be removed without damaging the PCB And it lends itself to automated assembly processes 28
Automotive
Multi-function HMI Source: Kromberg & Schubert GmbH & Co. KG BMW K46 Superbike Automotive Material: Ultramid T 4381 LDS
Presenter's Notes: 29 BMW motorcyles is employing a Multifunction Human Machine Interface, a switch assembly,That Features: A 14 function switchA reduction of size and weightThe substitution of a wiring harness and PCBThe Integration of connectors And a water tight assembly
Automotive
SMD Process Steps: Source: Kromberg & Schubert GmbH & Co. KG Automotive 3D Pick and Place Electrical Components
Presenter's Notes: 30 The switch assembly is assembled using 3D Pick and Place robots and reflow soldering
Automotive
HMITracability: Source: Kromberg & Schubert GmbH & Co. KG Data Matrix Code Automotive
Presenter's Notes: 31 One can get creative using LDS technology, here the part is tagged with a 3-dimensional scanner code for identification and tracability
Automotive
Potential Automotive-ApplicationsTracability: Source: Kromberg & Schubert GmbH & Co. KG Data Matrix Code Seat Module Sensors and Actuators In-Door Electronics Lightning Switches Automotive
Presenter's Notes: 32 The automotive sector is embracing LDS produced 3D-MID for the reductions in cost, weight, assembly times and the resultant increase in reliability. The 2014 model year will feature integration in the area of: Switches in the dash and steering wheel Seat modules containing seat-occupied and seat belt sensors LED position lighting In-Door electronics modules
Presenter's Notes: 33 This BMW prototype under development by TRW will integrate all steering wheel functions using surface mounted LEDs, electronics and switches.
Automotive
ASIC deposited onto MID with LPKF-LDS®technology Conventional Solution Sensor ASIC MID using LPKF-LDS® technology Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Flipped Positioned Signal Ground Support bumps Automotive
Presenter's Notes: 34 In this application, an Application Specific Integrated Circuit or ASIC, in a flip-chip format, is mounted to a single piece LDS produced MID carrier to produce a wheel rotation sensor.
Automotive
Qualification: Temperature Shock-40°C150°C Realized by Flip Chip on LPKF-LDS® MID Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Automotive
Presenter's Notes: 35 With a goal of increased reliability over a wide thermal cycling range
Automotive
Qualification: Warm-Humidity85°C/85% rel.H 300 pcs. - no defects after 1000h Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Automotive
Presenter's Notes: 36 And after 1,000 hours, 300 units experienced zero defects
Automotive
Former deviceDiameter approx. 10mm Prototype new Sensor Diameter: 5mm Realized by Flip Chip on LPKF-LDS® MID Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Automotive Final Part
Presenter's Notes: 37 This shows the evolution of the part; highlighting size and weight reduction of the part from old to new.
Automotive
Source: ZMD AG AMR Sensor (Automotive) Material: Vectra E840i LDS Automotive
Presenter's Notes: 38 In this example an AMR, a form of magnetic field sensor and its associated electrical components are housed in an LDS created 3D-MID for: Increased functionality in reduced space Precise 3D orientation of the sensor chip Minimized assembly complexity Increase tehe ease of assembly And have higher reliability============================(AMR stands for anisotropic magneto-resistance)
Sensors
Source: Harting Sensors
Presenter's Notes: 39 LDS produced 3D-MID are increasingly being used to mount Application Specific Intergrated Circuits in carriers, providing a protective package and easy component integration. Here are two examples of pressure sensors MIDs.
LED Lighting
LED Lighting
Presenter's Notes: 40 LDS produced 3D-MID are increasingly being used to mount Application Specific Intergrated Circuits in carriers, providing a protective package and easy component integration. Here are two examples of pressure sensors MIDs.
Automotive
LED Indicator Light Source: Kromberg & Schubert GmbH & Co. KG before after Automotive
Presenter's Notes: 41 LED lighting applications are moving into the consumer space in automotive, aircraft and sport lighting. Featuring a:Reduction of weight and sizeThe Substitution of socket and lampLonger life time with LED light sources Integrated cooling built using LDS metallization Adding up to a maintenance-free lighting system
Hundreds of millions of cell phone, tablet...
LPKF-LDS® antenna Cellular Electronics Hundreds of millions of cell phone, tablet antennas produced annually
Presenter's Notes: 42 Hundreds of millions of LDS cell phone and tablet antennas are produced annually
RFID
Source: Harting Mitronics AG RFID-Transponder RFID
Presenter's Notes: 43 In the RFID space, LDS 3D-MID provide flexibility to rapidly produce and change - Antenna patterns for different frequencies and applicationsAnd integrated protection of the devices
LDS 3D-MID
LDS 3D-MID
Presenter's Notes: 44 So LDS 3D-Molded Interconnect Devices are coming of age. It is a mature, cost effective, robust technology poised to expand into new markets that require efficient use of space, simpler assemblies and more reliable performance. Thank you for you time today. Please feel free to contact me with questions or to discuss a project.
Company Overview
Company Overview SelectConnect TechnologiesDivision of Arlington Plating CompanyPalatine, Illinois
Presenter's Notes: We are located in suburban Chicago. - SelectConnect Technologies Formed in 2009 as a division of Arlington Plating Company- To Manufacture 3D-MID (Molded Interconnect Devices) We developed the patented SelectConnectTM Plating Process for plating circuitry on plastic components using both the Laser Direct Structuring & Double Shot 3D-MID Processes 45
Company Overview
Company Overview SelectConnect TechnologiesDivision of Arlington Plating CompanyPalatine, Illinois Jim Liddle 847.359.1490jliddle@selectconnettech.comwww.selectconnecttech.com
Dedicated to innovative solutions for integrating electrical circuits and antennas on plastic components - Laser Direct Structuring (LDS) of three dimensional molded interconnects (3D-MID) and plating two-shot molded components.
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Learn about cryptographic hardware device protection using laser direct structuring (LDS) to create hardware protection circuitry on low cost injection molded housings and enclosures.
Laser Direct Structuring (LDS) is the most widely used method to produce cell phone handset antenna. It is now being used to integrate Wi-Fi, Bluetooth, GPS and cellular antenna into housings and enclosures. Cost reductions, rapid development of new designs and reduced space requirements are driving LDS created antennas. www.selectconnecttech.com
Transcript
SelectConnect Technologies
SelectConnect Technologies3D-Molded Interconnect Device Technical Reviewwww.selectconnecttech.com
Presenter's Notes: 1 Thank you for attending this mornings webcast, 3-D molded interconnect device technical review.
Contents
3D MID Double-Shot and Laser Direct Structuring Processes LDS Materials LDS Design Rules Applications/Markets Contents
Presenter's Notes: This is a technical review for electrical and mechanical engineers and project managers involved in designing your next-generation products. We will cover the two processes for producing 3-dimensional molded interconnects; Double-Shot molding and Laser Direct Structuring, with an emphasis on laser direct structuring.We will briefly examine available LDS materials and the fundamental design rules for designing LDS 3D MID. And conclude with application examples employing 3-D MID, from the medical device, automotive, sensors, antenna and RFID fields. 2
3D-Interconnects by DS / LDS
3D-Interconnects by DS / LDS Double-Shot Single-Shot LDS
Presenter's Notes: 3 Three dimensional molded interconnect devices are a method to integrate electronic circuitry and electrical components with injection molded carriers and enclosures and are used to miniaturize assemblies, reduce the bill of material, simplify designs, reduce assembly time and reduce costs of components and assemblies. The double-shot process is illustrated with the disposable insulin pump on the left, where circuitry is constructed by over-molding a plateable polycarbonate/ABS resin grade formed in the shape of the desired circuit, with a non-plateable polycarbonate material forming the chassis. The component is chemically etched and only the PC/ABS blended material is activated by the etchant. The plateable material is activated for plating using a palladium salt solution and the component is plated using an electroless process to complete the formation of the circuitry.The laser direct structuring method is illustrated in the part on the right. A laser is used to scribe circuit patterns onto a three-dimensional single-shot injection molded component. Both processes use an electroless plating process called the SelectConnect Process to metalize the circuit patterns, laying down a layer of electroless copper, electroless nickel, and finally, a layer of immersion gold or electrolytic gold for applications that require thicker layer of gold. It will focus on the LDS method of producing three-dimensional interconnects in this review.
LDS 3-D MID
LDS 3-D MID
Presenter's Notes: 4 LDS 3D-MID are comprised of injection molded thermoplastic components overlaid with circuit traces drawn on the three-dimensional part using a laser marking system. The plastic components are made from material doped with organometallic micro-particles. The areas marked by the laser are activated and are plateable using electroless plating chemistry. The circuit traces are drawn on the three-dimensional CAD model as a zero-height surface. A .step file is exported from the CAD system for translation into laser coordinates. The pattern is aligned using optically detected fiducials located on the component or the laser table and the pattern is scanned onto the part using preprogrammed laser parameters appropriate for the type of material.
LDS Summary
LDS Summary
Presenter's Notes: 5 The LDS process for producing 3-D MID is about 10 years old. It was developed in Germany by LPKF Laser and Electronics and for the first five or six years was a application looking for problem to solve. The first high volume application employing the LDS method for producing 3-D MID was in the area of cell phone antennas. Historically, antennas were modeled by hand, placing metal foil over forms and the antenna patterns were cut by hand using an Exact-O knife. The test piece was then placed in the RF range for evaluation. A new iteration of the antenna would require repeating this laborious process. Using the LDS process allows changes to be made to the drawing and accurately translated to parts in less time and with a higher degrees of accuracy.
LDS Summary
LDS Summary
Presenter's Notes: 6 Today: LDS is a mature, robust technology Cell Phone Antenna production is largest application, with tens of millions produced annually Europe is currently experiencing rapid growth in automotive, with BMW taking the lead, medical devices, antennas systems, sensors and RF-ID tags
LDS Technical Summary
LDS Technical Summary Laser Direct Structuring LDS
Presenter's Notes: 7 The laser source is a 16W diode pumped Neodymium-doped yttrium orthovanadate (Nd:YVO4) system operating in the near-infrared at 1064 nm with a focused spot size of 65µm. The system uses a high-speed scanner and optical z-axis for the 3D beam delivery with typical positioning speeds in the range of 1 to 4 meters per second.The lasers interaction with the material surface is two-fold, the beam activates the surface by reducing the organometallic dopant to metal particles and it roughens up the surface providing a texture for mechanical adherence of the metalized layer.
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: 8 We often denote the lasers impact on the material surface as a channel carved out of the material, but recent data for PC/ABS material shows just the opposite. The surface hit by the laser is roughened and raised in columnar fashion some 5 to 25 µm.
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: 9 Here is a profile of a circuit after plating.
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: In a view from an variable pressure Scanning Electron Microscope (SEM), the surface topography is evident. 10
LDS Technical Summary
LDS Technical Summary
Presenter's Notes: In this SEM image a Back-Scattered Electron Detector highlights the metal catalyst additive appearing here as bright spots. 11
LDS Pitch for High Yield
LDS Pitch for High Yield 8 mil lines 10 mil spaces (18 mil pitch)
Presenter's Notes: 12 LDS resolution of 6 mil lines and 8 mil spaces possible, with higher yields from 8 mil lines and 10 mil spaces. 4 mil lines and 6 mil spaces is possible on LCP material.
Business Drivers for 3D-MID
Kavo Dental Tool Business Drivers for 3D-MID
Presenter's Notes: 13 Why pursue an LDS 3D-MID strategy? The LDSs market drivers are to Reduce: Reduce Size, weight and complexity of assemblies And to reduce Costs through reduction in number of components, wires, interconnects and assembly time Benefits include improvement in: Reliability Functionality Here we see an example of a newly designed dental cavity detection system that uses LDS components. The new design features a completely self contained hand held laser caries detection system.
Business Drivers for 3D-MID
Business Drivers for 3D-MID Kavo Dental Tool
Presenter's Notes: 14 The product has gone from a lunch pail sized electronics package with a tethered laser, to a self contained laser in a hand held device that communicates results wirelessly to a base station.
LDS Grade Materials
LDS Grade Materials Reflow temperatures Pb Free 245 -260° C Sn/Pb 225 -235° C
Presenter's Notes: 15 A wide range of materials is available and qualified for LDS applications, from commodity materials through engineering resins with both amorphous and semi-crystalline characteristics. A family of high heat nylons, PET, PBT and blends are amenable to lead solder reflow mounting of components and LCP resins will perform with lead-free reflow solders.====================================================== PET Polyethylene TerephthalatePBT - Polybutylene TerephthalatePPA PolyphthalamidePSU PolysulfonePES PolyethersulfoneHTN PolyamidePA6/6T- Nylons
LDS Design Rules
LDS Design Rules Siemans Hearing Aid Component
Presenter's Notes: 16 One of the important developments of 3-dimensional circuitry is the efficient use of space with the finest possible structures. When designing components for LDS production, one needs to keep a few basic design rules in mind.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 17 The areas to be laser activated must remain in the line of sight of the laser beam. The work zone of the laser is an area 160 x 160mm or approximately 6 square inches and the laser has a working distance of approximately 1 inch, which means the laser can focus on a part that has a Z range of height of 1 inch.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 18 It is possible to lase patterns on all sides of a part by designing a multi-position fixture or a fixture that can rotate parts for multiple passes.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 19 When positioning the parts in a fixture we have a maximum angle of incidence of the beam impinging on the part of 70 degrees.Angles of incidence exceeding 70° are reduced by rotating the component during laser processing.
LDS Design Rules
LDS Design Rules Optimum cycle times
Presenter's Notes: 20 For parts with multiple surfaces with 90 degree angles, the part is mounted at an angle and is rotated to complete the activation.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 21 Plated through holes are activated using Conical Vias on one or both sides depending on part thickness.Thick walls require an aspect ratio of 2:1, while thinner parts can use simple cones with a 1:1 ratio.
LDS Design Rules
LDS Design Rules
Presenter's Notes: 22 When designing molds, we must pay attention to the location of walls and ejection pins. Zones to be activated should not directly touch walls Activation area separation for walls with an angle up to 45° should be kept at >150 µm or 6 mil Steeper walls with angles up to about 70° should be separated by 250 µm or greater or 10 mil Ejector pins should be placed to avoid the activation areas
SelectConnect Metallization
Metallization Electroless Copper Nickel Immersion Gold [Electroless Gold]Typical builds: SelectConnect Metallization
Presenter's Notes: The plating process consists of electroless plating chemistries, typically starting with a layer of 100 to 250 micro-inches of copper, followed by a 50 to 150 micro inch layer of nickel and an optional thin layer of immersion gold or a gold layer built using electroless gold chemistry that can build a more substantial gold layer. Metal thickness can be customized to meet the needs of the design. 23
Key Markets / Applications
Key Markets / Applications
Presenter's Notes: 24 Lets take a look at some application examples in the area of: Medical Devices Military / Defense / Aerospace Automotive Electronics Antennas RFID
Medical Devices
Medical Devices OmniPod® Insulin Management System OEM: InsuletMolder:Phillips PlasticsPlater:Arlington PlatingMaterial:PC, PC/ABS (doped)Process:DS (Double Shot)
Presenter's Notes: This is the Omni Pod from Insulet Corporation. It is a disposable insulin pump and blood glucose measurement system AdvantagesDisposableCommunicates Wirelessly with the Handheld Provides mechanical support and electrical connectivity Smaller, lighter - Allows for integration of more electronic functions- Eliminates complicated assemblies 25
Medical Devices
3-dimensional PCB for Hearing AidsStereo hearing aid component: Source: Harting / Siemens process steps Material: Vectra E820i LDS Medical Devices
Presenter's Notes: 26 In this example, Siemens developed an integrated approach to mounting components on a 3-dimensional carrier for their hearing aids.
Medical Devices
Switch Ring for Caries Diagnostic Laser PenFeatures:Reduction of assembly time (6s vs. 20s)Increase of assembly yieldReduction of parts (3 vs. 8)Reduction of cost (78%) Source: KaVo Dental Material: Vectra E840i LDS Medical Devices
Presenter's Notes: 27 The Kavo dental caries detection tool Features:An LDS produced mode switch assembly that provided a:Reduction of assembly time from 20 seconds to 6 secondsIncrease of assembly yieldReduction of the number of parts from 8 to 3And a cost reduction of 78%
Military / Defense
Military / Defense Security Housing Manufacturer: BournsMaterial: Pocan DP 7102 (PBT)
Presenter's Notes: Security ShieldsAre a injection molded enclosure with a layer of delicate and geometrically fine tracks covering the inside of the security housing. The tracks are less than 10 m thick making it difficult to detect using X-rays. They are designed to protect against conducting and non-conducting drill bits and are resistant to chemical attack.Benefits over other solutions include: It is simple to attach to the PCB Fewer assembly steps The elimination of epoxy potting The design allows for recovery of PCB for repair, upgrade or data recovery Housing can be removed without damaging the PCB And it lends itself to automated assembly processes 28
Automotive
Multi-function HMI Source: Kromberg & Schubert GmbH & Co. KG BMW K46 Superbike Automotive Material: Ultramid T 4381 LDS
Presenter's Notes: 29 BMW motorcyles is employing a Multifunction Human Machine Interface, a switch assembly,That Features: A 14 function switchA reduction of size and weightThe substitution of a wiring harness and PCBThe Integration of connectors And a water tight assembly
Automotive
SMD Process Steps: Source: Kromberg & Schubert GmbH & Co. KG Automotive 3D Pick and Place Electrical Components
Presenter's Notes: 30 The switch assembly is assembled using 3D Pick and Place robots and reflow soldering
Automotive
HMITracability: Source: Kromberg & Schubert GmbH & Co. KG Data Matrix Code Automotive
Presenter's Notes: 31 One can get creative using LDS technology, here the part is tagged with a 3-dimensional scanner code for identification and tracability
Automotive
Potential Automotive-ApplicationsTracability: Source: Kromberg & Schubert GmbH & Co. KG Data Matrix Code Seat Module Sensors and Actuators In-Door Electronics Lightning Switches Automotive
Presenter's Notes: 32 The automotive sector is embracing LDS produced 3D-MID for the reductions in cost, weight, assembly times and the resultant increase in reliability. The 2014 model year will feature integration in the area of: Switches in the dash and steering wheel Seat modules containing seat-occupied and seat belt sensors LED position lighting In-Door electronics modules
Automotive
Automotive Steering WheelTRWs Base-Line MID after assembly: Source: I&T 3D-Produktionsgesellschaft mbH Automotive
Presenter's Notes: 33 This BMW prototype under development by TRW will integrate all steering wheel functions using surface mounted LEDs, electronics and switches.
Automotive
ASIC deposited onto MID with LPKF-LDS®technology Conventional Solution Sensor ASIC MID using LPKF-LDS® technology Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Flipped Positioned Signal Ground Support bumps Automotive
Presenter's Notes: 34 In this application, an Application Specific Integrated Circuit or ASIC, in a flip-chip format, is mounted to a single piece LDS produced MID carrier to produce a wheel rotation sensor.
Automotive
Qualification: Temperature Shock-40°C150°C Realized by Flip Chip on LPKF-LDS® MID Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Automotive
Presenter's Notes: 35 With a goal of increased reliability over a wide thermal cycling range
Automotive
Qualification: Warm-Humidity85°C/85% rel.H 300 pcs. - no defects after 1000h Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Automotive
Presenter's Notes: 36 And after 1,000 hours, 300 units experienced zero defects
Automotive
Former deviceDiameter approx. 10mm Prototype new Sensor Diameter: 5mm Realized by Flip Chip on LPKF-LDS® MID Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Automotive Final Part
Presenter's Notes: 37 This shows the evolution of the part; highlighting size and weight reduction of the part from old to new.
Automotive
Source: ZMD AG AMR Sensor (Automotive) Material: Vectra E840i LDS Automotive
Presenter's Notes: 38 In this example an AMR, a form of magnetic field sensor and its associated electrical components are housed in an LDS created 3D-MID for: Increased functionality in reduced space Precise 3D orientation of the sensor chip Minimized assembly complexity Increase tehe ease of assembly And have higher reliability============================(AMR stands for anisotropic magneto-resistance)
Sensors
Source: Harting Sensors
Presenter's Notes: 39 LDS produced 3D-MID are increasingly being used to mount Application Specific Intergrated Circuits in carriers, providing a protective package and easy component integration. Here are two examples of pressure sensors MIDs.
LED Lighting
LED Lighting
Presenter's Notes: 40 LDS produced 3D-MID are increasingly being used to mount Application Specific Intergrated Circuits in carriers, providing a protective package and easy component integration. Here are two examples of pressure sensors MIDs.
Automotive
LED Indicator Light Source: Kromberg & Schubert GmbH & Co. KG before after Automotive
Presenter's Notes: 41 LED lighting applications are moving into the consumer space in automotive, aircraft and sport lighting. Featuring a:Reduction of weight and sizeThe Substitution of socket and lampLonger life time with LED light sources Integrated cooling built using LDS metallization Adding up to a maintenance-free lighting system
Hundreds of millions of cell phone, tablet...
LPKF-LDS® antenna Cellular Electronics Hundreds of millions of cell phone, tablet antennas produced annually
Presenter's Notes: 42 Hundreds of millions of LDS cell phone and tablet antennas are produced annually
RFID
Source: Harting Mitronics AG RFID-Transponder RFID
Presenter's Notes: 43 In the RFID space, LDS 3D-MID provide flexibility to rapidly produce and change - Antenna patterns for different frequencies and applicationsAnd integrated protection of the devices
LDS 3D-MID
LDS 3D-MID
Presenter's Notes: 44 So LDS 3D-Molded Interconnect Devices are coming of age. It is a mature, cost effective, robust technology poised to expand into new markets that require efficient use of space, simpler assemblies and more reliable performance. Thank you for you time today. Please feel free to contact me with questions or to discuss a project.
Company Overview
Company Overview SelectConnect TechnologiesDivision of Arlington Plating CompanyPalatine, Illinois
Presenter's Notes: We are located in suburban Chicago. - SelectConnect Technologies Formed in 2009 as a division of Arlington Plating Company- To Manufacture 3D-MID (Molded Interconnect Devices) We developed the patented SelectConnectTM Plating Process for plating circuitry on plastic components using both the Laser Direct Structuring & Double Shot 3D-MID Processes 45
Company Overview
Company Overview SelectConnect TechnologiesDivision of Arlington Plating CompanyPalatine, Illinois Jim Liddle 847.359.1490jliddle@selectconnettech.comwww.selectconnecttech.com
Presenter's Notes: 46