Learn about cryptographic hardware device protection using laser direct structuring (LDS) to create hardware protection circuitry on low cost injection molded housings and enclosures.
SelectConnect TechnologiesU.S. Based Service Provider of Laser Direct Structured (LDS) Antenna www.selectconnecttech.com
Presenter's Notes: My name is Jim Liddle. Thank you for joining me today to learn about our SelectConnect Technologies, U.S. based, LDS antenna services. 1
Three Dimentional Antenna
Three Dimentional Antenna
Presenter's Notes: 2 Laser direct structuring or LDS is the method used to produce virtually every cell phone antenna today because it offers streamlined development time on new formats and patterns and the ability to cost effectively produce in high volumes.Molex, Tyco Electronics and Laird Technologies pioneered the high volume LDS production of handset antennas and when volumes reached multi-million units, operations were moved to China leaving other smaller volume and development projects without a U.S. based service provider.
LDS 3-D MID
LDS 3-D MID
Presenter's Notes: 3 Three dimensional circuits on plastic carriers like LDS 3D-antenna, are a form of three-dimensional molded interconnect device or 3D-MID. They are comprised of injection molded thermoplastic carriers overlaid with circuit traces drawn on a three-dimensional plastic coupon using the LPKF laser marking system. The plastic components are made from an LDS grade material that is compounded with an additive. The areas marked by the laser become activated and will plate using electroless plating chemistry. The circuit traces are drawn on the three-dimensional CAD model as a zero-height surface. A .step file is exported from the CAD system for translation into laser coordinates.
Presenter's Notes: 4 LDS is the most widely used method to create 3-D handset antenna, with hundreds of millions produced annually. SelectConnect Technologies provides LDS services here in the United States, from prototype development through mid-volume production quantities up to one million. We can be a local, strategic member of your supply chain for lasing and plating of LDS antenna for handset, Wi-Fi, Bluetooth and RFID antennas.
LDS Antenna Integration
LDS Antenna Integration
Presenter's Notes: 5 Laser Direct Structuring has slashed antenna development time allowing RF engineers to rapidly set up and run many integrations of patterns and get changes made to the pattern within a day for testing. The LDS process allows pattern changes to be made to the drawing and accurately translated to the carrier in less time and with a higher degree of accuracy. Antenna can be integrated into existing housings and enclosures taking advantage of available space.
2-Shot Process
2-Shot Process
Presenter's Notes: 6 SelectConnect also supports double-shot antenna, where circuitry is constructed by over-molding a plateable resin grade formed in the shape of the antenna pattern on a non-plateable resin forming the carrier. The component is chemically activated and the first shot material is selectively plated.
LDS Technical Summary
LDS Technical Summary Laser Direct Structuring LDS
Presenter's Notes: 7 LDS antenna patterns are laser marked onto an LDS grade polymer exposing small metallic particles within the resin, forming nucleation sites to initiate copper plating . The surface is also ablated in the process, roughening it for good mechanical adherence of the plating.
3D-Antenna by LDS and DS
3D-Antenna by LDS and DS
Presenter's Notes: 8 LDS creates circuitry on three-dimensional parts, accurately following the geometry of the part to make reproducible antenna patterns.
LDS Grade Materials
LDS Grade Materials Reflow temperatures Pb Free 245 -260° C Sn/Pb 225 -235° C
Presenter's Notes: 9 A wide range of engineering resins with both amorphous and semi-crystalline characteristics is available and qualified for LDS applications giving designers a selection of physical and electrical properties to choose from. ===================================PET Polyethylene TerephthalatePBT - Polybutylene TerephthalatePPA PolyphthalamidePSU PolysulfonePES PolyethersulfoneHTN PolyamidePA6/6T- Nylons
Attach components to circuitry
Attach components to circuitry
Presenter's Notes: 10 A family of high heat nylons, PET, PBT and alloys are amenable to lead-solder reflow mounting of electrical components and LCP or PPA resins are suitable for lead-free reflow soldering. Antenna patterns accurately track the three-dimensional carrier for enhanced performance. ======================================================
Slide 11
Presenter's Notes: 11 Plated through-holes are used to electrically connect two sides of a component for double sided applications.
Presenter's Notes: The plating process typically consists of 100 to 250 micro-inches copper foundation, followed by a 50 to 100 micro-inch layer of nickel and an optional immersion gold layer if wire bounding or soldering to the part. A more substantial layer of gold can be built up using electroless gold chemistry. Metal thickness can be customized to meet the needs of the design. 12
RFID
Source: Harting Mitronics AG RFID-Transponder RFID
Presenter's Notes: 13 In the RFID space, LDS 3D-MID provide flexibility to rapidly produce and change antenna patterns for different form factors and frequencies and the antenna and components are securely incorporated into the housing protecting them from environmental and impact conditions.
Sensors
Source: Harting Sensors
Presenter's Notes: 14 LDS produced 3D-MID are used to mount ASICs, an Application Specific Intergrated Circuit, in carriers, providing a protective, multi-layer chip integration package. Here are two examples of pressure sensors MIDs holding an ASIC.
ITAR RegisteredISO 9001: 2008
ITAR RegisteredISO 9001: 2008
Presenter's Notes: SelectConnect Technologies is an ISO 9001 and ITAR registered, US based service provider bridging the gap between prototypes and your first million pieces. We are located in suburban Chicago. 15
Supply Chain Partners
Supply Chain Partners Aerospace, medical, defense and large volume molding High quality, prototypes and low volume, fast turn molding
Presenter's Notes: We have the right partnerships for your project needs, whether it be large volume, aerospace, military or medical or fast turn, high quality prototype and low volume production of injected molded parts. 16
Doing Business with us
Doing Business with us Prototypes Fast Turn Around on Iterations Volume Production - Lazing and plating LDS and two-shot metalization Engineering Services for LDS Antenna Patterns Cost Effective and Competitive ITAR Registered ISO 9001:2008
Presenter's Notes: 17 We are geared toward helping you succeed with your wireless antenna project by providing development help, prototypes and consulting services on LDS antenna integration.
LDS 3D-MID
LDS 3D-MID
Presenter's Notes: 18 LDS methods of producing and integrating antenna and wireless components is a mature, cost effective and robust technology poised to expand into new markets and applications that require efficient use of space, simpler assemblies and more reliable performance.
Company Overview
Company Overview SelectConnect TechnologiesDivision of Arlington Plating CompanyPalatine, Illinois Suburban ChicagoJim Liddle 847.359.1490jliddle@selectconnecttech.comwww.selectconnecttech.com
Presenter's Notes: Please feel free to contact us if you have questions or to discuss your application .We are located in suburban Chicago. Thank you for attending the LDS antenna technical overview. 19
About This Presentation
Laser Direct Structuring (LDS) is the most widely used method to produce cell phone handset antenna. It is now being used to integrate Wi-Fi, Bluetooth, GPS and cellular antenna into housings and enclosures. Cost reductions, rapid development of new designs and reduced space requirements are driving LDS created antennas. www.selectconnecttech.com
Dedicated to innovative solutions for integrating electrical circuits and antennas on plastic components - Laser Direct Structuring (LDS) of three dimensional molded interconnects (3D-MID) and plating two-shot molded components.
Laser Direct Structuring of Wireless Antenna
Laser Direct Structuring (LDS) is the most widely used method to produce cell phone handset antenna. It is now being used to integrate Wi-Fi, Bluetooth, GPS and cellular antenna into housings and enclosures. Cost reductions, rapid development of new designs and reduced space requirements are driving LDS created antennas. www.selectconnecttech.com
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Learn about cryptographic hardware device protection using laser direct structuring (LDS) to create hardware protection circuitry on low cost injection molded housings and enclosures.
Transcript
SelectConnect TechnologiesU.S. Based Service...
SelectConnect TechnologiesU.S. Based Service Provider of Laser Direct Structured (LDS) Antenna www.selectconnecttech.com
Presenter's Notes: My name is Jim Liddle. Thank you for joining me today to learn about our SelectConnect Technologies, U.S. based, LDS antenna services. 1
Three Dimentional Antenna
Three Dimentional Antenna
Presenter's Notes: 2 Laser direct structuring or LDS is the method used to produce virtually every cell phone antenna today because it offers streamlined development time on new formats and patterns and the ability to cost effectively produce in high volumes.Molex, Tyco Electronics and Laird Technologies pioneered the high volume LDS production of handset antennas and when volumes reached multi-million units, operations were moved to China leaving other smaller volume and development projects without a U.S. based service provider.
LDS 3-D MID
LDS 3-D MID
Presenter's Notes: 3 Three dimensional circuits on plastic carriers like LDS 3D-antenna, are a form of three-dimensional molded interconnect device or 3D-MID. They are comprised of injection molded thermoplastic carriers overlaid with circuit traces drawn on a three-dimensional plastic coupon using the LPKF laser marking system. The plastic components are made from an LDS grade material that is compounded with an additive. The areas marked by the laser become activated and will plate using electroless plating chemistry. The circuit traces are drawn on the three-dimensional CAD model as a zero-height surface. A .step file is exported from the CAD system for translation into laser coordinates.
Cellular LDS Antenna
LDS antenna Material: Pocan DP T7140 LDS Cellular LDS Antenna
Presenter's Notes: 4 LDS is the most widely used method to create 3-D handset antenna, with hundreds of millions produced annually. SelectConnect Technologies provides LDS services here in the United States, from prototype development through mid-volume production quantities up to one million. We can be a local, strategic member of your supply chain for lasing and plating of LDS antenna for handset, Wi-Fi, Bluetooth and RFID antennas.
LDS Antenna Integration
LDS Antenna Integration
Presenter's Notes: 5 Laser Direct Structuring has slashed antenna development time allowing RF engineers to rapidly set up and run many integrations of patterns and get changes made to the pattern within a day for testing. The LDS process allows pattern changes to be made to the drawing and accurately translated to the carrier in less time and with a higher degree of accuracy. Antenna can be integrated into existing housings and enclosures taking advantage of available space.
2-Shot Process
2-Shot Process
Presenter's Notes: 6 SelectConnect also supports double-shot antenna, where circuitry is constructed by over-molding a plateable resin grade formed in the shape of the antenna pattern on a non-plateable resin forming the carrier. The component is chemically activated and the first shot material is selectively plated.
LDS Technical Summary
LDS Technical Summary Laser Direct Structuring LDS
Presenter's Notes: 7 LDS antenna patterns are laser marked onto an LDS grade polymer exposing small metallic particles within the resin, forming nucleation sites to initiate copper plating . The surface is also ablated in the process, roughening it for good mechanical adherence of the plating.
3D-Antenna by LDS and DS
3D-Antenna by LDS and DS
Presenter's Notes: 8 LDS creates circuitry on three-dimensional parts, accurately following the geometry of the part to make reproducible antenna patterns.
LDS Grade Materials
LDS Grade Materials Reflow temperatures Pb Free 245 -260° C Sn/Pb 225 -235° C
Presenter's Notes: 9 A wide range of engineering resins with both amorphous and semi-crystalline characteristics is available and qualified for LDS applications giving designers a selection of physical and electrical properties to choose from. ===================================PET Polyethylene TerephthalatePBT - Polybutylene TerephthalatePPA PolyphthalamidePSU PolysulfonePES PolyethersulfoneHTN PolyamidePA6/6T- Nylons
Attach components to circuitry
Attach components to circuitry
Presenter's Notes: 10 A family of high heat nylons, PET, PBT and alloys are amenable to lead-solder reflow mounting of electrical components and LCP or PPA resins are suitable for lead-free reflow soldering. Antenna patterns accurately track the three-dimensional carrier for enhanced performance. ======================================================
Slide 11
Presenter's Notes: 11 Plated through-holes are used to electrically connect two sides of a component for double sided applications.
SelectConnect Metallization
Metallization Electroless Copper Nickel Immersion Gold [Electroless Gold]Typical builds: SelectConnect Metallization
Presenter's Notes: The plating process typically consists of 100 to 250 micro-inches copper foundation, followed by a 50 to 100 micro-inch layer of nickel and an optional immersion gold layer if wire bounding or soldering to the part. A more substantial layer of gold can be built up using electroless gold chemistry. Metal thickness can be customized to meet the needs of the design. 12
RFID
Source: Harting Mitronics AG RFID-Transponder RFID
Presenter's Notes: 13 In the RFID space, LDS 3D-MID provide flexibility to rapidly produce and change antenna patterns for different form factors and frequencies and the antenna and components are securely incorporated into the housing protecting them from environmental and impact conditions.
Sensors
Source: Harting Sensors
Presenter's Notes: 14 LDS produced 3D-MID are used to mount ASICs, an Application Specific Intergrated Circuit, in carriers, providing a protective, multi-layer chip integration package. Here are two examples of pressure sensors MIDs holding an ASIC.
ITAR RegisteredISO 9001: 2008
ITAR RegisteredISO 9001: 2008
Presenter's Notes: SelectConnect Technologies is an ISO 9001 and ITAR registered, US based service provider bridging the gap between prototypes and your first million pieces. We are located in suburban Chicago. 15
Supply Chain Partners
Supply Chain Partners Aerospace, medical, defense and large volume molding High quality, prototypes and low volume, fast turn molding
Presenter's Notes: We have the right partnerships for your project needs, whether it be large volume, aerospace, military or medical or fast turn, high quality prototype and low volume production of injected molded parts. 16
Doing Business with us
Doing Business with us Prototypes Fast Turn Around on Iterations Volume Production - Lazing and plating LDS and two-shot metalization Engineering Services for LDS Antenna Patterns Cost Effective and Competitive ITAR Registered ISO 9001:2008
Presenter's Notes: 17 We are geared toward helping you succeed with your wireless antenna project by providing development help, prototypes and consulting services on LDS antenna integration.
LDS 3D-MID
LDS 3D-MID
Presenter's Notes: 18 LDS methods of producing and integrating antenna and wireless components is a mature, cost effective and robust technology poised to expand into new markets and applications that require efficient use of space, simpler assemblies and more reliable performance.
Company Overview
Company Overview SelectConnect TechnologiesDivision of Arlington Plating CompanyPalatine, Illinois Suburban ChicagoJim Liddle 847.359.1490jliddle@selectconnecttech.comwww.selectconnecttech.com
Presenter's Notes: Please feel free to contact us if you have questions or to discuss your application .We are located in suburban Chicago. Thank you for attending the LDS antenna technical overview. 19